Simple process concept
Coating, drying, handling and heat press bonding can be considered according to the part and process.
CAM Bonding
Thin bonding with surface treatment characteristics.
CAM bonding is a bonding technology based on the Chemical and Melting concept. A thin CAM layer is formed and bonded by heat and pressure at the required timing.
What is CAM bonding?
CAM bonding aims to provide bonding that is easy to use like an adhesive and thin like a surface treatment. The technology is evaluated according to the material combination, required function and process conditions.
Low coating amount
The CAM layer is used as a thin bonding interface, making it suitable for applications where thick adhesive build-up is undesirable.
For various materials
CAM bonding can be evaluated for metals, resins, glass, ceramics and composite components.
CAM bonding process
A thin CAM layer is applied, dried, handled and bonded by heat press or thermal compression according to the application.
Coating
Apply a thin CAM layer to the target surface.
Drying
Form a thin interfacial bonding layer.
Handling
Parts can be handled after drying depending on the design.
Heat press bonding
Bond at the required timing using heat and pressure.
Upper material
Thin CAM layer
Lower material
↓
Bonding by heat and pressure
Thin bonding layer
The thin interfacial layer contributes to dimensional control and low thermal resistance concepts.
Dissimilar material bonding
The technology can be evaluated for metal, glass, ceramic, resin and semiconductor-related components.
Application-specific design
Bonding strength, heat resistance, insulation and sealing are considered according to the use case.
Potential applications
CAM bonding can be discussed for applications where thin bonding, dissimilar material bonding or functional interfaces are required.
Heat dissipation components
Heat sinks, power electronics components and related thermal parts.
Laminated metals
Motor cores, aluminum/copper parts and other laminated components.
Sealing components
Cooling plates and parts requiring sealing or liquid resistance.
Insulating bonding
Metal bonding with direct short-circuit suppression.
Metal and resin composites
Lightweight and composite material components.
Glass and ceramics
Optical, sensor and hard material components.
Bonding examples
Examples of prototype bonding and evaluation samples are shown to illustrate possible applications.
