FAQ
Frequently asked questions about CAM bonding technology
Basics of CAM bonding
This page explains the technology concept in a clear and practical way.
What is CAM bonding?
CAM bonding is a bonding technology that combines the concepts of chemical bonding and melting. A thin CAM layer is formed on the target surface, and composite bonding is realized by heat press or thermal compression.
Is CAM bonding an adhesive?
CAM bonding can be used in a way that resembles adhesive bonding, but it differs because a liquid CAM agent is coated and dried to form a thin CAM layer before bonding.
How is it different from welding or mechanical fastening?
Welding and mechanical fastening perform physical joining. CAM bonding performs chemical bonding at the interface between the CAM layer and the target material.
Supported materials and applications
What materials can be supported?
CAM bonding can support a wide range of materials, including metals, ceramics and plastics. Please contact us to discuss your application.
Can CAM bonding be used for dissimilar metal bonding?
Dissimilar metal bonding can be supported when a CAM layer can be formed on the target materials. Metal-to-ceramic and other dissimilar material combinations can also be supported.
Can it be used for heat dissipation components?
Because the CAM layer can be formed thinly, bonding with reduced thermal resistance can be realized. Thermal performance should be evaluated.
Thin-film bonding, insulation, sealing and heat resistance
Is thin-film bonding possible?
The CAM layer is designed as a very thin functional film.
Can insulation be added?
The CAM layer is based on an organic film concept, so it has the function of an insulating interface. Insulation performance depends on substrate, film thickness, shape, bonding conditions and operating environment.
Can sealing or water resistance be provided?
Sealing and water resistance can be provided according to the application. Results depend on substrate, film thickness, shape, bonding conditions and operating environment.
How are bonding conditions determined?
Bonding conditions vary depending on materials, surface condition, part geometry and required functions. Heat press bonding at 200°C or higher may be considered as a reference, but detailed conditions are confirmed by testing.
Trial processing, joint development and licensing
Can trial processing be requested?
Trial processing and sample evaluation can be discussed. Please share non-confidential information about materials, application, required functions, operating environment and sample availability.
Is joint development possible?
Joint development of application-specific CAM agents and processes can be discussed. Initial discussions are available online.
Can licensing be discussed?
Licensing related to target materials and processes can be discussed. Product target, application, production assumptions and region are reviewed individually.
Can NDA and confidential information be handled?
Technical consultation and joint development after NDA execution can be discussed. For the first inquiry, please share only non-confidential information.
Applicability and evaluation methods depend on materials, shape, required functions and operating environment.
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